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  symbol max p-channel units v ds v v gs v i dm t j ,t stg c symbol typ max 40 50 67 80 r q jl 33 40 symbol typ max 38 50 66 80 r q jl 30 40 maximumjunctiontolead c steadystate c/w parameter units maximumjunctiontoambient a t10s r q ja maximumjunctiontoambient a steadystate maximumjunctiontoambient a steadystate c/w maximumjunctiontolead c steadystate c/w thermal characteristics: p-channel c/w c/w units c/w junctionandstoragetemperaturerange 55to150 55to150 thermal characteristics: n-channelparameter maximumjunctiontoambient a t10s r q ja t a =70c powerdissipation t a =25c p d 30 30 20 drainsourcevoltage absolute maximum ratings t a =25c unless otherwise noted parameter max n-channel w 7.5 6 30 2.51.6 5.3 6.6 2.51.6 30 20 gatesourcevoltage a continuousdraincurrent a t a =25c i d t a =70c pulseddraincurrent b aop605complementary enhancement mode field effect transistor features n-channel p-channelv ds (v)=30v30v i d =7.5a (v gs =10v) 6.6a (v gs =10v) r ds(on) <28m w (v gs =10v) <35m w (v gs =10v) <43m w (v gs =4.5v) <58m w (v gs =4.5v) general description theaop605/lusesadvancedtrenchtechnologytoprovideexcellentr ds(on) andlowgatecharge.the complementarymosfetsformahighspeedpowerinverter,suitableforamultitudeofapplications. aop605andaop605lareelectricallyidentical. rohscompliant aop605lishalogenfree g1 s1 g2 s2 d1 d1 d2 d2 12 3 4 87 6 5 pdip-8 g2 d2s2 g1 d1s1 n-channel p-channel pdip8top view bottom view alpha & omega semiconductor, ltd.
aop605 symbol min typ max units bv dss 30 v 1 t j =55c 5 i gss 100 na v gs(th) 1 1.8 3 v i d(on) 30 a 22.6 28 t j =125c 33 43 m g fs 12 16 s v sd 0.76 1 v i s 4 a c iss 680 820 pf c oss 102 pf c rss 77 pf r g 1.2 2 q g (10v) 13.84 16.6 nc q g 6.74 8.1 nc q gs 1.82 nc q gd 3.2 nc t d(on) 4.6 ns t r 4.1 ns t d(off) 20.6 ns t f 5.2 ns t rr 16.5 20 ns q rr 7.8 nc thisproducthasbeendesignedandqualifiedfortheconsumermarket.applicationsorusesascritical componentsinlifesupportdevicesorsystemsarenotauthorized.aosdoesnotassumeanyliabilityarising outofsuchapplicationsorusesofitsproducts.aosreservestherighttoimproveproductdesign, functionsandreliabilitywithoutnotice. bodydiodereverserecoverycharge bodydiodereverserecoverytime totalgatecharge v gs =4.5v,v ds =15v,i d =7.5a i f =7.5a,di/dt=100a/ s i f =7.5a,di/dt=100a/ s turnoffdelaytime turnofffalltime turnondelaytime v gs =10v,v ds =15v,r l =2.0 , r gen =6 gateresistance v gs =0v,v ds =0v,f=1mhz bodydiodeforwardvoltage i s =1a,v gs =0v v gs =0v,v ds =15v,f=1mhz reversetransfercapacitance inputcapacitance outputcapacitance. switching parameters totalgatecharge gatesourcecharge gatedraincharge turnonrisetime maximumbodydiodecontinuouscurrent dynamic parameters m v gs =4.5v,i d =6.0a r ds(on) staticdrainsourceonresistance v gs =10v,i d =7.5a forwardtransconductance v ds =5v,i d =7.5a gatethresholdvoltage v ds =v gs i d =250 a onstatedraincurrent v gs =10v,v ds =5v a gatebodyleakagecurrent v ds =0v,v gs =20v n-channel mosfet electrical characteristics (t j =25c unless otherwise noted) parameter conditions static parameters drainsourcebreakdownvoltage i d =250 a,v gs =0v i dss zerogatevoltagedraincurrent v ds =24v,v gs =0v a:thevalueofr ja ismeasuredwiththedevicemountedon1in 2 fr4boardwith2oz.copper,inastillairenvironmentwitht a =25c.thevalue inany givenapplicationdependsontheuser'sspecificboarddesign.thecurrentratingisbasedonthet 10sthermalresistancerating. b:repetitiverating,pulsewidthlimitedbyjunctiontemperature. c.ther ja isthesumofthethermalimpedencefromjunctiontoleadr jl andleadtoambient. d.thestaticcharacteristicsinfigures1to6areobtainedusing80 spulses,dutycycle0.5%max. e.thesetestsareperformedwiththedevicemountedon1in 2 fr4boardwith2oz.copper,inastillairenvironmentwitht a =25c.thesoa curveprovidesasinglepulserating. rev4:jan2009 alphaomegasemiconductor,ltd.
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aop605 symbol min typ max units bv dss 30 v 1 t j =55c 5 i gss 100 na v gs(th) 1.2 2 2.4 v i d(on) 30 a 28 35 t j =125c 37 45 44 58 m g fs 13 s v sd 0.76 1 v i s 4.2 a c iss 920 1100 pf c oss 190 pf c rss 122 pf r g 3.6 4.4 q g (10v) 18.5 22.2 nc q g (4.5v) 9.6 11.6 nc q gs 2.7 nc q gd 4.5 nc t d(on) 7.7 ns t r 5.7 ns t d(off) 20.2 ns t f 9.5 ns t rr 20 24 ns q rr 8.8 nc thisproducthasbeendesignedandqualifiedfortheconsumermarket.applicationsorusesascritical componentsinlifesupportdevicesorsystemsarenotauthorized.aosdoesnotassumeanyliabilityarising outofsuchapplicationsorusesofitsproducts.aosreservestherighttoimproveproductdesign, functionsandreliabilitywithoutnotice. p-channel mosfet electrical characteristics (t j =25c unless otherwise noted) parameter conditions static parameters drainsourcebreakdownvoltage i d =250 a,v gs =0v i dss zerogatevoltagedraincurrent v ds =24v,v gs =0v a gatebodyleakagecurrent v ds =0v,v gs =20v m v gs =4.5v,i d =5a gatethresholdvoltage v ds =v gs i d =250 a onstatedraincurrent v gs =10v,v ds =5v v ds =5v,i d =6.6a r ds(on) staticdrainsourceonresistance forwardtransconductance v gs =10v,i d =6.6a diodeforwardvoltage i s =1a,v gs =0v maximumbodydiodecontinuouscurrent outputcapacitance reversetransfercapacitance gateresistance dynamic parameters inputcapacitance v gs =0v,v ds =15v,f=1mhz v gs =0v,v ds =0v,f=1mhz totalgatecharge(4.5v) gatesourcecharge gatedraincharge switching parameters totalgatecharge(10v) v gs =10v,v ds =15v,i d =6.6a turnondelaytime v gs =10v,v ds =15v,r l =2.3 , r gen =3 turnonrisetime turnoffdelaytime turnofffalltime bodydiodereverserecoverytime i f =6.6a,di/dt=100a/ s bodydiodereverserecoverycharge i f =6.6a,di/dt=100a/ s a:thevalueofr ja ismeasuredwiththedevicemountedon1in 2 fr4boardwith2oz.copper,inastillairenvironmentwitht a =25c.the valueinanyagivenapplicationdependsontheuser'sspecificboarddesign.thecurrentratingisbasedonthet 10sthermalresistance rating. b:repetitiverating,pulsewidthlimitedbyjunctiontemperature. c.ther ja isthesumofthethermalimpedencefromjunctiontoleadr jl andleadtoambient. d.thestaticcharacteristicsinfigures1to6,12,14areobtainedusing80 spulses,dutycycle0.5%max. e.thesetestsareperformedwiththedevicemountedon1in 2 fr4boardwith2oz.copper,inastillairenvironmentwitht a =25c.the soacurveprovidesasinglepulserating. a:thevalueofr ja ismeasuredwiththedevicemountedon1in 2 fr4boardwith2oz.copper,inastillairenvironmentwitht a =25c.the valueinany givenapplicationdependsontheuser'sspecificboarddesign.thecurrentratingisbasedonthet 10sthermalresistance rating. b:repetitiverating,pulsewidthlimitedbyjunctiontemperature. c.ther ja isthesumofthethermalimpedencefromjunctiontoleadr jl andleadtoambient. d.thestaticcharacteristicsinfigures1to6,12,14areobtainedusing80 spulses,dutycycle0.5%max. e.thesetestsareperformedwiththedevicemountedon1in 2 fr4boardwith2oz.copper,inastillairenvironmentwitht a =25c.the soacurveprovidesasinglepulserating. rev4:jan2009 alphaomegasemiconductor,ltd.
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